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Within the hardware development team we have an opportunity for a hardware mechanical engineer to join the team that is focusing on introducing customised and generic solutions to the major telecom operators around the world (AT&T, Vodafone Italy, Proximus, Telstra, NBN, …) for their outside plant deployments of fiber and copper line terminations. These products, called SEMs (Sealed Enclosure Micronodes), will be installed on walls, poles, pits, basements. Your main challenge will be to design these custom BBA BU solutions and changes in all its physical design aspects, that support DSLAM’s while providing relevant functionality with regards to copper and fibre termination & interconnect, power and power back-up as well as cooling, whilst respecting relevant noise, regulatory and esthetical considerations. To achieve the above mentioned requirements, the team continuously looks for innovations through new techniques like fin bonding, fin moulding, extrusion moulding and alternative types of sealing methods. You will join this division and participate in the overall product development cycle from mechanical product conception until start of mass production. You will be part of a multidisciplinary team consisting of system architects, SW engineers and other HW disciplines with daily interaction to third parties, procurement and industrialisation teams. Tasks will include: · feasibility studies · 3D development · 2D documentation · Interaction with procurement to select the best supplier. · technical follow up for third parties for hardware related tasks (physical design, mechanical design, ...) · technical follow up of HW qualification and certification · industrialisation and link to manufacturing


Mandatory: · Background in electromechanical engineering (0 to 5 years experience) · Commitment to drive technical problems to a solution autonomously · Creative and innovative attitude · Strong analytical and problem-solving skills · Experience CREO2.0 and PDM link or Intra link Assets: · Skilled in the mechanical design of high volume products taking into account industrialisation and manufacturing requirements · Experience in working with ODM or subcontracting partners · Experience in physical design aspects o EMC o Cooling o Safety o Moulding techniques o Thermal analysis and improvements o Making IP 68 compliant products o Corrosion resistance of a product o Power & system partitioning strategy · Knowledge of qualification standards (ETSI, ANSI and MII market)

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